服务与应用

Probe Card Micro‑Hole Drilling

探针卡应用的微孔钻孔可在多种材料中有效进行,包括氮化硅、聚酰亚胺、Ultem 等。 

Potomac Laser-Drilling Capabilities

可以采用激光钻孔技术在大面积上钻出小至 2 微米的微孔,且位置公差非常严格。根据材料所需的厚度,可以钻出精确规格的受控锥形微孔。还可以利用与微孔相同的技术钻出用于组装和定位的较大孔。

Advantages of Laser-Drilling for Probe Cards

Versatility

Lasers can create a wide range of hole shapes, including circular, square, conical, and rectangular.

Precision

Lasers offer unparalleled control, ensuring accuracy and detail.

Consistency

Programmable and non-wearing, lasers deliver reliable results over extended production runs.

Speed

Lasers meet the high demands of swift manufacturing cycles with remarkable efficiency.

Quality

Ultrashort pulsed lasers minimize thermal impact, enhancing material quality and ensuring superior results.

10mil 厚氮化硅探针卡,带 90um 微孔-sm
波托马克 RPM

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